IME 2017, Shanghai, China

Oct 25-27, 2017
Exhibition booth B118

From 25 - 27 Oct 2017, IMST and partner T-Solution will present innovations in the field of 3D EM design in addition to their extensive offering of services and products for communication technology at IME in Shanghai, China which will be held at Shanghai Everbright Convention & Exhibition Center

The new 3D EM solver EMPIRE XPU 7.6 will be presented which covers nearly all today’s design challenges for RF designers, like antennas, passive circuits, packages, waveguides and EMC/EMI problems. EMPIRE XPU enables accurate full 3D EM design of larger and more complex structures compared to conventional EM simulation tools.

As a special highlight, we present a very different way of viewing electronic circuits for the first time. With Vive® virtual reality glasses and software developed by IMST, you have the opportunity to walk through various 3D designs or even have a look from the bird’s perspective.

Come and experience the new possibilities and have a discussion with our experts at Booth 118.

"EMPIRE XPU – Efficient Solving of Large Scale EM Problems"

Booth Image